The Usage Of Polishing Pad
2022/05/19
1. The polishing liquid is effectively and evenly transported to different areas of the polishing pad.
2. After polishing, the chemical reaction is fully carried out and the reactants and debris are discharged smoothly and the removal effect is achieved.
3. Maintaining the polished liquid film on the surface of the polishing pad so that the chemical reaction is fully carried out.
4. Keep the polishing process smooth, the surface is not deformed, in order to obtain a better wafer surface topography.
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